Farmington Hills, Michigan – December 18, 2025 – IRISO, a global leader in advanced interconnect technology, is excited to announce its participation in
CES 2026, taking place
January 6–9 at the
Las Vegas Convention Center. This year, IRISO will be joined by
co-exhibitor Mektec, a renowned manufacturer of flexible printed circuits (FPCs), at
booth 5459 in the LVCC West Hall.
CES, the world’s most influential tech event, provides a premier stage for IRISO and Mektec to present their latest innovations and collaborate on solutions that address the evolving needs of the automotive market.
Visitors to booth 5459 can expect to see:
- Next-Generation Connectors: IRISO’s high-speed and robust interconnect solutions.
- Flexible Printed Circuits: Mektec’s advanced FPC technologies designed for compact, high-performance applications.
“We’re thrilled to return to CES and even more excited to collaborate with Mektec this year,” said
Kimira Atsushi, President of IRISO USA, Inc. “Together, we’re showcasing a powerful synergy of interconnect and flexible circuit technologies that are shaping the future of connectivity.”
IRISO and Mektec invite all CES 2026 attendees to visit
booth 5459 in the West Hall to explore how their combined expertise is driving innovation across industries. To schedule a meeting during CES, click “Contact” in the menu bar above.
About IRISO
Headquartered in Japan, IRISO is a leading manufacturer of advanced interconnect solutions, serving global markets in automotive, industrial, and consumer electronics. With a focus on quality, innovation, and customer satisfaction, IRISO continues to deliver high-performance connectors that meet the demands of tomorrow’s technologies.
About Mektec
Mektec is a global leader in flexible printed circuit (FPC) technology, offering innovative solutions for compact and high-density electronic applications. With a commitment to precision and reliability, Mektec supports a wide range of industries including automotive, mobile devices, and medical equipment.
